Common PCB layers and layer structures

2019-10-11 1306

Common PCB layer structure

The common layer structures of printed circuit boards include single layer PCB, double layer PCB, and multi layer PCB. The brief descriptions of these three layer structures are as follows:

(1) Single layer board: a circuit board that only has one side coated with copper and the other side not coated with copper. Generally, electronic components are placed on the side without copper coating, which is primarily used for wiring and soldering.

(2) Double layer board: a circuit board with copper on both sides, generally referred to as the top layer on one side and the bottom layer on the other side. Generally, the top layer is used as the surface for placing components, and the bottom layer is used as the surface for soldering components.

(3) Multilayer board: refers to a circuit board that contains multiple operational layers, including several intermediate layers in addition to the top and bottom layers. Generally, the intermediate layers can serve as wire layers, signal layers, power layers, ground layers, etc. Layers are insulated from each other, and the connection between layers is usually achieved through vias.

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4、 Common PCB layer structure composition

Printed circuit boards (produced by Jiepei PCB prototyping) include many types of operational layers, such as signal layers, protective layers, screen printing layers, internal layers, etc. The functions of each layer are briefly introduced as follows:

(1) Signal layer: primarily used to place components or wiring. Protel DXP generally consists of 30 intermediate layers, namely Mid Layer 1~Mid Layer 30. The intermediate layer is used to place signal lines, while the top and bottom layers are used to place components or copper plating.

(2) Protective layer: primarily used to ensure that areas on the circuit board that do not require tin plating are not tinned, thereby ensuring the reliability of the circuit board operation. Among them, Top Paste and Bottom Paste are respectively the top solder mask layer and the bottom solder mask layer; The Top Solder and Bottom Solder are respectively the solder paste protective layer and the bottom solder paste protective layer.

(3) Screen printing layer: primarily used to print the serial number, production number, company name, etc. of components on printed circuit boards.

(4) Internal layer: primarily used as a signal routing layer, Protel DXP contains a total of 16 internal layers.

(5) Other layers: primarily consisting of four types of layers.

Drill Guide: primarily used for drilling positions on printed circuit boards.

Article source: Jiangmen PCB Customizationhttp://www.yonghongpcb.com/