Printed circuit board (PCB), also known as printed circuit board, is a provider of electrical connections for electronic components with a history of more than 100 years. According to the number of layers on the circuit board, printed circuit boards can be divided into single panel, double-sided board, four layer board, six layer PCB board, and other multi-layer circuit boards. Up to now, printed circuit boards have reached a considerable level of precision, and many skills for improving and optimizing circuit boards have been continuously developed. The article first outlines the key skills used in the production of printed circuit boards, including high-density interconnect circuit boards, high-density arbitrary layer interconnect circuit boards, integrated printed circuit boards, high heat dissipation metal substrates, high-frequency high-speed printed circuit boards, and rigid flex printed circuit boards.

1. High density interconnect circuit board

In the early 1990s, Japan and the United States pioneered the use of High Density Interconnect Technology (HDI), which involves the use of double-sided circuit boards or multiple layers of circuit boards as core boards, and the use of multi-layer circuit board stacking techniques to maintain insulation between each layer of PCB boards, resulting in high-density and highly integrated electronic circuit boards. The five major features of this type of circuit board are "miniature, lightweight, high-frequency, precision, and heat dissipation". Continuously innovating process skills based on the five major characteristics is the current trend in the production of high-density electronic circuit boards. Thin layer "determines the survival foundation of high-density electronic circuits. Its birth directly led to and influenced the development of precise and micro skills. The precise connection of wires, precise micro drilling, and planning of insulation layers determine whether high-density electronic circuit boards can adapt to high-frequency operation and whether it is conducive to reasonable thermal conductivity. This is also an important method for determining the integration level of electronic circuits in ultra high density electronic circuit boards.

2. High density arbitrary layer interconnect printed circuit board

There are significant differences in the manufacturing process for HDI circuit boards with different hierarchical structures. Generally, the more multi-layered the structure, the more chaotic and precise it is, which brings greater difficulties to production and manufacturing. Now, there are several major technological features related to the connection between layers, including "step connection", "staggered hole connection", "cross layer connection", and "stacked hole connection", which will not be described in detail here. Ultra high density arbitrary layer interconnect printed circuit boards belong to high-end products in printed circuit boards. Its high demand comes from electronic product markets that require lightweight, thin, and multifunctional features, such as smartphones, laptops, digital cameras, and LCD TVs.

3. Integrated printed circuit board

Integrated printed circuit board (PCB) technology is the integration of one or more individual electronic components (such as resistors, capacitors, capacitors, etc.) into a PCB structure, making the integrated PCB a PCB with a certain degree of system functionality. It has the advantages of improving the reliability of electronic product system functionality, improving signal transmission performance, effectively reducing production costs, and making production processes more environmentally friendly. It is a skill path for the miniaturization of electronic device system integration and has great potential for market development. The system integration skill of embedding electronic components in printed boards has begun to enter the application stage abroad, and breakthroughs have been made in related materials and manufacturing process skills. Foreign companies that are in the forefront of the profession have begun to invest this skill in large-scale production.

4. High heat dissipation metal substrate

High heat dissipation metal substrates primarily utilize metal substrate materials that have excellent thermal conductivity to extract heat sources from high-power components. Its heat dissipation performance is related to the structural layout of multi chip (component) packaging and the reliability of component packaging. As a high-end printed circuit board, high heat dissipation metal printed boards have a metal substrate that is compatible with surface mount technology, reduces product volume, lowers hardware and device costs, replaces fragile ceramic substrates, and adds rigidity, all of which contribute to better mechanical durability. They demonstrate strong competitiveness among many heat dissipation substrates and have a very broad application prospect. And buried (embedded) metal based printed circuit boards are a type of partially implanted metal block printed circuit board, which is a new heat dissipation PCB technology that has emerged in recent years. Its heat dissipation planning concept is relatively advanced, and there have been no public reports of related skills in professional journals at home and abroad. As a high-power component heat dissipation substrate, it has the following advantages due to the special planning:

(1) Embedded planning, coplanar with PCB, does not affect surface mount (SMD);

(2) Compatible with PCB board production process.

(3) Excellent heat dissipation performance, direct contact between components and heat dissipation blocks, no heat dissipation bottleneck;

(4) Lightweight and compact, in line with the trend of lightweight, thin, short, and small electronic assembly;

(5) A sensitive planning approach that can fully meet the heat dissipation needs of individual high-power components;

5. High frequency and high-speed printed circuit board

High frequency and high-speed printed circuits were used in the military field as early as the end of the 20th century. In the past decade, due to the transfer of some high-frequency communication frequency bands originally intended for military use to civilian use, civilian high-frequency and high-speed information transmission skills have rapidly improved, promoting the advancement of electronic information technology skills in various industries. It has features such as remote communication, remote medical surgery, and automated control and handling of large logistics warehouses. It should be pointed out that working in the electronic components and printed circuit board industry for high-frequency signal transmission requires strict skills, such as working impedance range, metal wire smoothness, requirements for line width for high-frequency and high-speed signals, and relative spacing between signal lines and ground layers. The technological skills have driven the industrialization of electronic components and products, and it is estimated that the demand will increase by more than 10 times in the next 5 years.

6. Scratching printed circuit board skills

In recent years, the high performance, multifunctionality, and small and lightweight development of electronic devices have shown an accelerating trend. Therefore, the demand for miniaturization and high density of electronic components and PCBs used in electronic devices is also increasing. In order to adapt to these requirements and innovate the production skills of rigid (hard) PCB multilayer boards, various multilayer boards are promoted for use in electronic devices. However, portable devices, digital video cameras, and other mobile devices not only accelerate the cycle of adding new features or improving performance, but also have a strong tendency towards small, lightweight, and prioritized planning. Therefore, the limited and narrow space provided for functional components inside the chassis is necessary for maximum effective utilization. In this case, a system structure consisting of several small multilayer boards and flexible boards (FPCs) or cables that connect them is often used, which is called imitating rigid flex PCBs. Rigid flex PCB also uses this combination and is particularly space saving, making it a functional composite multilayer board that integrates rare rigid PCB and FPC. Rigid flex PCBs are widely used in mobile devices because they do not require connectors or space for connectors and have almost the same level of installation as rigid PCBs.

Article source: Jiangmen PCB Customizationhttp://www.yonghongpcb.com/