Three proof adhesive does not contain volatile substances such as acetone and xylene, making it more environmentally friendly and safe. Mainly used to form protective films on electronic circuits and components, enhancing their moisture, dirt, mold, water, and salt spray resistance, avoiding corrosion of solder joints and conductors, as well as shielding and eliminating electromagnetic interference, avoiding short circuits, and improving the insulation function of circuit boards. In addition, the coating protective film is also beneficial for the wear resistance and solvent resistance of circuits and components, and can release the pressure caused by periodic temperature changes. Suitable processes for spraying, coating, brushing, dipping, etc. In order to better utilize the excellent functions of the three proof paint, the operation process is a very important link. Many of our users always feel like they haven't achieved the excellent protective effect they imagined when using three proof paint. In fact, a large part of the reason is due to the application process of three proof paint. Therefore, in order to better achieve the protective effect of three proof paint, it is necessary for us to understand the application process of three proof paint. There are four main types of anti adhesive application processes for PCB circuit boards by PCB manufacturers: 1. Brushing: manual operation, generally simple and convenient to use, can achieve excellent coating effect on smooth surfaces; 2. Spraying: the use of spray can products can be easily applied to maintenance and small-scale production. The spray gun is suitable for large-scale production, but these two spraying methods have high requirements on the accuracy of operation, and may cause shadows (where the lower part of the equipment is not coated with three proof paint); 3. Dip coating: Dip coating can ensure thorough film covering and will not cause material damage due to excessive spraying; 4. Selective coating of equipment: precise coating without damaging materials, suitable for large-scale coating, but with high requirements for coating equipment, most suitable for large-scale production of circuit board coatings.
Three proof paint operation process requirements:
A. The first step is to clean and dry the circuit board, remove moisture and water, and first remove the dust, moisture, oil stains, solder paste, etc. on the surface of the object to be coated, so that it can fully exert its protective effect. Thorough cleaning can ensure that corrosive residues are completely removed and that the three proof paint adheres well to the surface of the circuit board. Drying conditions: 60 ° C, 10-20 minutes, it is better to take it out in the oven and apply it while hot; B. Apply by brushing, and the brushing area should be larger than the area occupied by the equipment to ensure full coverage of the equipment and solder pads; C. When brushing, the board should be placed flat as much as possible, and there should be no dripping after brushing. The brushing should be flat and there should be no exposed parts, preferably between 0.1-0.3mm. D. Before brushing and spraying, ensure that the diluted product is thoroughly mixed, and close it for 2 hours to avoid solvent evaporation before brushing or spraying. Using high-quality natural fiber brushes, gently brush and dip at room temperature. If using machinery, the viscosity of the coating should be measured (using a viscosity agent or flow cup), and a diluent can be used to adjust the viscosity. E. After brushing, place it flat on the bracket and prepare for curing. Heating is needed to accelerate the curing of the coating. If the coating surface is uneven or contains bubbles, it should be left at room temperature for more time to allow the solvent to flash out when cured in a high-temperature furnace. F. During immersion coating, the circuit board components should be vertically immersed in the three proof paint residue. Connectors and related components should not be immersed unless carefully concealed. The circuit board should be immersed for 1 minute until the bubbles disappear, and then slowly removed. The surface of the circuit board will form a uniform film layer. Most of the three proof paint residue should be allowed to flow back from the circuit board to the dip coating machine or dip coating furnace. The immersion speed of electronic circuit boards or components should not be too fast to avoid excessive bubbles. G. If there is any crust on the surface after immersion coating, remove the epidermis and continue to use.

UV Three proof Adhesive:
Single component UV/moisture dual layer curing adhesive can quickly cure under UV irradiation. After UV curing, the light shielding part can also be cured by moisture, and it has a fluorescent display effect. This product complies with RoHS compatibility testing.
Organic silicon three proof adhesive:
1955 is a low viscosity single component room temperature cured silicone coating adhesive. This product has the following characteristics: it solidifies to form a tough and wear-resistant surface; It can be cured at room temperature or accelerated by heating after solvent evaporation (recommended curing temperature ≤ 60 ℃); UV indication can be used to detect whether the coating is complete. Coating protection for thick film circuit systems, porous substrates, and printed circuit boards.
1916 single component room temperature curing organic silicone gel, which can be cured at room temperature or accelerated by heating; Low viscosity, easy to spray, dip, brush or pour; Colorless and transparent, solvent-free, low odor, non corrosive to PC, copper, etc; Good resistance to high and low temperatures, stable at -60 ℃ to 200 ℃; Completely comply with the requirements of the EU RoHS and REACH directives. Widely used in various electronic components and circuit boards, it forms a protective film on the surface to prevent corrosion, dust, moisture, leakage, short circuit, thermal shock, aging, salt spray, and extend its service life.
Article sourced from Jiangmen single and double-sided circuit boardhttp://www.yonghongpcb.com
09-09
Schematic diagram of Jiangmen single and double-sided circuit board
1. There are now various specialized PCB drawing software, such as Protel, which can draw multi-layer (including double-sided) circuit board diagrams. The layers are aligned in orientation and have vi
09-09
Schematic diagram of Jiangmen single and double-sided circuit board
1. There are now various specialized PCB drawing software, such as Protel, which can draw multi-layer (including double-sided) circuit board diagrams. The layers are aligned in orientation and have vi
09-09
Schematic diagram of Jiangmen single and double-sided circuit board
1. There are now various specialized PCB drawing software, such as Protel, which can draw multi-layer (including double-sided) circuit board diagrams. The layers are aligned in orientation and have vi
04-27
What is the structure of blind buried hole circuit board?
blind and buried viascircuit boardIt has the ability to freely bend, fold, and roll, and can move and stretch freely in three-dimensional space; Good heat dissipation performance and high precision; T