There are several reasons why circuit board manufacturers can lay copper on circuit boards:

1. EMC provides shielding for large areas of ground or power supply copper, and some special measures, such as PGND, provide protection.

2. PCB process requirements. Generally, in order to ensure the electroplating effect or prevent deformation during lamination, copper is laid on PCB layers with less wiring.

3. The requirement for signal integrity is to provide a complete return path for high-frequency digital signals and reduce the wiring of DC networks. Of course, there are also reasons such as heat dissipation, special device installation requirements for copper plating, and so on.

1、 One of the major benefits of copper laying is to reduce the ground impedance of Jiangmen single and double-sided circuit boards (anti-interference is also largely caused by the reduction of ground impedance). There are a large number of peak pulse currents in digital circuits, so reducing ground impedance is more necessary. It is generally believed that circuits composed entirely of digital devices should be laid on a large area, while for analog circuits, the ground loop formed by copper laying can cause electromagnetic coupling interference that is not worth the loss (except for high-frequency circuits). Therefore, not all circuits require plain copper (BTW: Mesh laid copper has better laying performance than a whole block)

2、 The significance of laying copper in a circuit lies in: 1. Connecting copper to the ground wire can reduce the circuit area. 2. Large area copper laying is equivalent to reducing the resistance of the ground wire and reducing the voltage drop. From these two points, whether it is digital ground or analog ground, copper should be laid to increase anti-interference ability. Moreover, at high frequencies, digital ground and analog ground should be separated and copper should be laid separately, and then connected with a single point. This single point can be wound several times on a magnetic ring with a wire and then connected. However, if the frequency is not too high or the working conditions of the instrument are not harsh, it can be relatively relaxed. A crystal oscillator can be considered as a high-frequency emission source in a circuit. You can lay copper around it and then ground the outer shell of the crystal oscillator, which will be better.

3、 The difference between the whole piece and the grid of copper plated single-sided and double-sided circuit boards in Jiangmen

Specifically, there are approximately three functions to analyze: 1. Aesthetic 2. Noise suppression 3. To reduce high-frequency interference (due to reasons on the circuit board)

According to the wiring principle: why do we need to add grids when the power supply and the geological layer are as wide as possible? Isn't it not in line with the principle? If we look at it from a high-frequency perspective, it's even more wrong. The most taboo thing when wiring at high frequencies is sharp wiring, and having multiple 90 degree wires in the power layer can cause many problems. Actually, why do we do it that way is entirely a requirement of craftsmanship: check if the hand welded ones are painted like that, almost none; If you see such a drawing, there must be a surface mount chip on it. At that time, there was a process called wave soldering, which required local heating of the board during the mounting process. If all copper was laid, the specific heat coefficients of the two sides would be different, and the board would rise up. When the board was lifted up, the problem would arise. In the upper steel cover (which is also a process requirement), the pin of the chip was prone to errors, and the scrap rate would increase linearly. In fact, this method also has its disadvantages: under our current corrosion process, the film is easily stuck on top. In the later strong acid engineering, that point may not corrode anymore, and there may be a lot of scrap, but only the board is broken and the chip and board are damaged together.

Of course, there are also some surface stickers that do not have grids added. From the perspective of product consistency, there may be two situations: 1. The corrosion process is very good; 2. Instead of using wave soldering, a more advanced reflow soldering method was adopted, but this would increase the investment of the entire assembly line by 3-5 times.

Article sourced from Jiangmen single and double-sided circuit boardhttp://www.yonghongpcb.com