Multi layer circuit board manufacturers tell you how to add circuit boards to resist deformation

1. Use PCB materials with high Tg. High Tg means high rigidity, but the price will also increase accordingly, which requires a trade-off.

2. Add the thickness of the PCB circuit board. If it can be advocated to use circuit boards with a thickness of 1.6mm or more as much as possible. If it is still necessary to use boards with thicknesses of 0.8mm, 1.0mm, and 1.2mm, it is recommended to use furnace fixtures to support and strengthen the deformation of the boards during furnace passing. Although it is possible to test the decline.

3. Apply Epoxy glue (potted) onto the circuit board. It is also possible to consider applying glue around the BGA or on the back of its corresponding circuit board to enhance its stress resistance.

4. Add steel bars around the BGA. If there is space, it can be considered to reinforce the resistance to stress by placing supportive iron frames around the BGA, similar to building a house.

The deformation of the circuit board caused by the decrease in external force

1. Strengthen the strength of the outer shell to avoid deformation affecting the internal circuit board.

2. Add screws or positioning fixing tissues around the BGA in the printed circuit board. If our intention is only to maintain BGA, then we can forcibly fix the adjacent tissues of BGA to prevent deformation.

3. Add organizational buffer planning for circuit boards.

Enhance the reliability of BGA.

1. Glue the bottom of BGA.

2. Add soldering amount. But it must be controlled in a way that cannot short-circuit.

3. Use SMD (Solder Mask Designed) layout. Cover the solder pads with green paint.

4. Increase the size of BGA solder pads on the circuit board. This will make the wiring of the circuit board difficult, as the gap between balls that can be wired becomes smaller.

5. Use Vias in pad (VIP) planning. But the via on the solder pad must be filled with electroplating, otherwise bubbles will be generated during reflow, which may simply cause the solder ball to crack from the middle.

Article source: PCB manufacturerhttp://www.yonghongpcb.com/