Excess glue is FPCflexible circuit boardA common quality abnormality phenomenon in the lamination process is glue overflow, which refers to the phenomenon where the temperature rises during the lamination process, causing the glue system in the COVERLAY to flow and resulting in glue stains similar to the EXPORY series on the PAD position of the FPC flexible circuit board. There are many reasons for FPC flexible circuit board overflow, so we should propose different solutions based on the specific situation.

1. Overflowing glue is formed during the COVERLAY production process

So, FPC flexible circuit board manufacturers should strictly inspect incoming materials. If there is excess glue during incoming sampling, they should contact the supplier for return or exchange. Otherwise, it is difficult to control excess glue during the production process.

2. Overflowing glue is formed by the storage environment

It is best for FPC flexible circuit board manufacturers to establish a dedicated freezer to store the protective film. If the CL adhesive system becomes damp due to inadequate storage conditions, low-temperature pre drying of CL can greatly improve the amount of CL overflow. In addition, CL requirements that are not used up on the same day should be promptly returned to the freezer for storage.

3. Partial overflow caused by independent small PAD positions

This phenomenon is currently the most common quality abnormality encountered by most FPC flexible circuit board manufacturers in China. If the process parameters are changed simply to solve the problem of glue overflow, it will bring new problems such as bubbles or insufficient peel strength. Therefore, the process parameters can only be adjusted reasonably.

4. Rubber overflow caused by the operating method

When the FPC flexible circuit board is falsely connected, it is necessary to require employees to accurately align, calibrate the alignment fixtures, and increase the viewing force of alignment to avoid glue overflow due to alignment prohibition. At the same time, do a good job in the "5S" operation when pressing false joints. Before alignment, check whether the protective film CL is contaminated and whether there are burrs.

5. Adhesive overflow caused by FPC flexible circuit board factory process

If a fast press machine is used for pressing, extending the pre pressing time, reducing pressure, lowering temperature, and reducing the pressing time appropriately are all beneficial for reducing the amount of overflow. If the pressure of the press is uneven, induction paper can be used to test whether the pressure of the press is uniform, and the fast press supplier can be contacted to debug the machine equipment.

Article sourced from Jiangmen single and double-sided circuit boardhttp://www.yonghongpcb.com/