The production of circuit boards is a complex process, and as the motherboard of a product, it always bears more or less risks and responsibilities. Especially during the soldering process of the circuit board, it tests whether the touch between the motherboard and the components is intact. If not taken seriously, it can lead to poor or even impossible operation of the entire product.

The circuit board should be dust-free throughout the production process, especially during exposure, etching, subsequent tin spraying, gold deposition, testing, and packaging processes, to prevent debris from reaching the solder paste or solder pads and affecting soldering. Our company will particularly strengthen these processes to ensure zero complaints and reactions as the ultimate goal. During the manual inspection process, attention should be paid to ensuring that there are no sweat stains on the hands, and gloves should be worn as much as possible when operating. During this process, surface mount assembly personnel should also pay attention to cleaning the solder pads as much as possible before welding. If the solder pads are very fine and strict requirements are required. As for gold-plated circuit boards, special attention should be paid to being exposed to external air oxidation and sweat oxidation. gold-plated circuit boards are more prone to oxidation. Welding manufacturers and customers should try to ensure that the factory packaging of the circuit board manufacturer is intact before preparing the patch, and not easily remove the vacuum packaging, otherwise oxidation will make it difficult to patch in the future.

When spraying tin on circuit boards, attention should be paid to ensuring the cleanliness and tidiness of the tin surface, especially to ensuring the flatness of the tin surface. Spraying tin may cause water stains, which are caused by unclean tin surface and should be reworked. Uneven tin surface should be caused by improper operation during the tin spraying process and should be adjusted in a timely manner. SMT chip manufacturers should pay attention to cleaning the solder surface as much as possible before soldering. Fine solder pads should ensure that the solder is full during soldering, and if possible, flux soldering should be increased. Generally, environmentally friendly products are now required, so lead-free tin is used when leaving the factory. Lead free circuit boards can cause difficulty in soldering, and appropriate soldering flux can be added during soldering to assist in saturating the solder pads of the circuit board.

If slight oxidation is found during the soldering of a gold-plated circuit board, it should be cleaned with alcohol first, and then soldering flux should be added. It usually doesn't cause too many problems.

Article sourced from Jiangmen single and double-sided circuit boardhttp://www.yonghongpcb.com