1. Under normal conditions, all equipment should be placed on one side of the printed circuit board, and the side with the type, specification, and nameplate printed on it should be facing up for easy viewing, processing, equipment, and repair. The equipment for single-sided printed circuit boards can only be installed on the side without printed circuit copper foil. If insulation is required, insulation film (which can be replaced by photographic film) can be placed between the equipment and the printed circuit, or a 1-2mm gap can be left between the equipment and the board.

2. The elemental equipment on the board should be arranged in a straight line as much as possible according to the circuit schematic, and the circuit arrangement should be compact, dense, and neat. The wiring at all levels should not be parallel or parallel. This is particularly important for high-frequency and broadband circuits.

3. If due to the limitation of the board surface, it is not possible to install all the equipment on one printed circuit board, or if it is necessary to divide the whole machine into several printed circuit board devices for shielding purposes, each assembled printed circuit should form an independent function for independent adjustment, maintenance, and repair.

4. To facilitate the reduction of volume or improvement of mechanical strength, one or even multiple auxiliary boards can be installed in addition to the primary printed circuit board. The auxiliary board can be made of metal, printed circuit board or insulation board. Some bulky equipment such as transformers, chokes, amplifiers, etc. can be attached to the auxiliary board and fastened with accessories.

5. For components with strong electromagnetic radiation and active electromagnetic induction, the position of the equipment should avoid their mutual influence. Can increase the distance between them or shield them from each other. The orientation of the placement of the equipment should be interspersed with adjacent printed conductors. Especially for inductive equipment, special attention should be paid to adopting measures to avoid electromagnetic interference.

6. For heating element equipment, priority should be given to arranging them in locations that are conducive to heat dissipation. If necessary, a radiator can be set up independently to reduce temperature and minimize the impact on nearby equipment. The heat sink of transistors and rectifying components can be directly installed on their casing, or the heat sink can be fixed to a printed circuit board, chassis, or machine bottom plate. High power resistors can be made by bending a cylindrical aluminum plate with a thickness of 1-3mm and good thermal conductivity, tightly attached to the resistor housing, and fixed for heat dissipation.

7. For thermal sensitive components, they should be kept away from high temperature areas, and perhaps a partition wall structure should be used to disconnect the heat source from them to avoid being affected by the heating element.

8. Heavy and large components should be placed on the printed board as close to the fixed end as possible, and the center of gravity should be lowered to improve mechanical strength, vibration resistance, and impact resistance, and reduce the load deformation of the printed board.

9. General components can be directly soldered onto printed boards. But when the component exceeds 15g or the volume exceeds 27cm3, it should be considered to add metal fasteners for fixation to improve vibration and impact resistance.10. On the premise of ensuring functionality, components should be placed parallel or straight to each other for neatness and aesthetics. Generally, it is not allowed to stack components together. If stacking is necessary to tighten the plane scale, it is necessary to fix the components with mechanical support.

11. Ground wires (public wires) generally cannot be made into closed circuits to prevent self excitation of the circuit.

12. Some high-power, high or medium power transistors, resistors and other components should be placed in simple heat dissipation areas and separated from other components by a certain distance.

13. Components that need to be connected to external circuits through printed connectors, especially integrated circuit blocks that generate high current signals or important pulses, should be placed as close to the plug surface as possible.

14. The layout of signal source circuits such as clock pulse generators and timing pulse generators should consider having a wide range of equipment positions to reduce and avoid interference with other circuits.

15. The axial direction of the components on the printed circuit board of the electronic circuit installed on the oscillation device should be consistent with the primary oscillation direction of the machine.

In order to improve the reliability of the equipment, efforts should be made to minimize the contact points, bottom board connection wires, and solder joints between the printed plugs and sockets used in the entire device. When you can solve a problem with a larger printed circuit board, do not divide it into two or more small pieces.

Article source: Jiangmen PCB Customizationhttp://www.yonghongpcb.com/