There are mainly single-layer and double-layer circuit boards, as well as multi-layer circuit boards. The most commonly used are single-layer and double-layer circuit boards, while those with more than three layers are called multi-layer circuit boards. For different industries, there are different requirements for shape, size, color, model, and number of layers. Let's take a look at the differences between single-sided, double-sided, and multi sided circuit boards.

Differences in the number of layers between single-sided, double-sided, and multi-layer circuit boards:

The simple point is the difference between single-sided wiring, double-sided wiring, and multi-layer wiring.

1. Single panel: one layer of dielectric, one side for wiring and one side for ground;

2. Double sided board: one layer of dielectric, double-sided wiring;

3. Multilayer board: usually at least 4 layers, multi-layer dielectric, multi-layer wiring.

Structural differences between single-sided, double-sided, and multi-layer circuit boards:

The so-called single-sided and double-sided surfaces have different layers of copper. Double sided refers to a board with copper on both sides, which can be connected through via holes. And there is only one layer of copper on one side, which can only be used for simple circuits, and the holes made can only be used for plug-ins and cannot conduct.

1. Single sided printed circuit boards are usually made of single-sided copper-clad laminates, and etched circuit patterns are created on the surface of copper using screen printing or photoimaging methods. Excess copper foil is removed by chemical etching to form conductor patterns.

2. Double sided printed circuit boards have two layers of conductor patterns, with the upper and lower conductive holes connected by through holes. In the processing of printed circuit boards, copper layers are plated on the walls of the holes with expensive perforations to make the upper and lower layers conductive. Double sided printed circuit boards usually use double-sided copper foil laminates, and corrosion-resistant circuit patterns are manufactured on the copper surface using screen printing or photoimaging methods. Excess copper foil is removed by chemical etching to form conductor patterns.

3. The conductor pattern of multi-layer printed circuit boards has three or more layers, and the conductor layers are divided into inner and outer layers. The inner layer is a conductor pattern completely sandwiched inside the multi-layer board; The outer layer is a conductor pattern on the surface of a multi-layer board. In general, during production, the inner conductor pattern is processed first, and then the holes and outer conductor pattern are processed after pressing. The connection between the inner and outer layers is achieved through metalized holes.

The manufacturing process of single-sided and double-sided circuit boards is basically similar, with relatively simple structure and manufacturing. However, multi-layer circuit boards are different, with high requirements for structural design and process manufacturing. The higher the number of layers, the more difficult it is.

Article source: Jiangmen PCB Customizationhttp://www.yonghongpcb.com/